Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition
Early glimpse of very compact form millimeter-wave chipset commercially available for handset applications. The post Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition appeared...
View ArticleIntel’s Embedded Multi-Die Interconnect Bridge (EMIB)
First consumer application in the Intel Core 8th Generation i7-8809G, the world’s first On-Package CPU and GPU with High Bandwidth Memory. The post Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)...
View ArticleSamsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel...
The first ultra-small multi-chip High Volume Manufacturing (HVM) FO-PLP device for consumer applications found in the Samsung Galaxy Watch The post Samsung Exynos 9110 with ePLP: First Generation of...
View ArticleAdvanced packaging technology in the Apple Watch Series 4’s System-in-Package
Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA. The post Advanced packaging technology in the Apple Watch Series 4’s...
View ArticleTexas Instruments AWR1843AoP 77/79 GHz Radar Chipset
World’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-on-Package. The post Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset appeared first on...
View ArticleAdvanced System-in-Package Technology in Apple’s AirPods Pro
Analysis of Apple’s first SiP found in the latest AirPods, featuring a fully integrated SiP for audio codec and Bluetooth connectivity. The post Advanced System-in-Package Technology in Apple’s AirPods...
View ArticleInfineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel...
Deep dive into the first Human Machine Interaction (HMI) system with Infineon’s 60 GHz Radar On-Chip AoP BGT60TR13C and Knowles’ DSP IA8508. The post Infineon’s Radar Technology and Knowles’ Machine...
View ArticleIntel Foveros 3D Packaging Technology
Intel Core i5-L16G7: the first utilisation of Intel’s Foveros Technology with Package-on-Package configuration in a consumer product. The post Intel Foveros 3D Packaging Technology appeared first on...
View ArticleNVIDIA A100 Ampere GPU
NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging. The post NVIDIA A100 Ampere GPU appeared first on System Plus Consulting.
View ArticleQualcomm Snapdragon 888 System on Chip with 5G Modem
Deep dive analysis of Qualcomm’s SoC architecture using Samsung 5nm process technology. The post Qualcomm Snapdragon 888 System on Chip with 5G Modem appeared first on System Plus Consulting.
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